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Inventor

Kenji Akai

Inventor
Tokyo, JP

Overview

2→
Patents
2000–2014
Patent span
Mechanical engineering
Primary field (CPC F)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

F24Fprimary
F24FAir-conditioning50%
G01BMeasuring length, thickness or similar linear dimensions50%
PatentTitleYear
8,734,575'Airflow controlling device and method'20146,025,596'Method for measuring epitaxial film thickness of multilayer epitaxial wafer'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000Based in Tokuyama, JP· patent location history
2014Patents assigned to AKAI KENJI (1)· patent assignee history
2014Patents assigned to AZBIL CORP (1)· patent assignee history
2014Patents assigned to HORIGUCHI YASUKO (1)· patent assignee history
2014Patents assigned to MIURA MAYUMI (1)· patent assignee history
2014Patents assigned to SAWADA SHUJI (1)· patent assignee history
2014Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AKAI KENJIself12014
AZBIL CORP12014
HORIGUCHI YASUKO12014
MIURA MAYUMI12014
SAWADA SHUJI12014
Locations
LocationPatentsSpan
Tokyo, JP12014
Tokuyama, JP12000