Inventor
BANGWEON LEE
Inventor
KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
B22FWorking metallic powder11%
C09KMaterials for miscellaneous applications, not provided for elsewhere11%
H01QAntennas, i.e. radio aerials11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
12,494,412Semiconductor package202512,469,764Semiconductor package202512,243,803Thermal interface material, method of manufacturing the same, and semiconductor packages including the same202511,935,812Thermal interface material and semiconductor packages including the same202411,855,013Semiconductor device202311,380,635Semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2022–2025Based in KR· patent location history
2024–2025Patents assigned to UNIV INDUSTRY COOPERATION GROUP KYUNG HEE UNIV (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 6 | 2022–2025 |
| UNIV INDUSTRY COOPERATION GROUP KYUNG HEE UNIV | 2 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 6 | 2022–2025 |