LexDanaLexDanabeta
Inventor

DAISUKE SOUMA

Inventor
JP

Overview

3→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H05KPrinted circuits14%
B22FWorking metallic powder7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
C22CAlloys7%
C23CCoating metallic material7%
C25DProcesses for the electrolytic or electrophoretic production of coatings7%
H01LSemiconductor devices7%
PatentTitleYear
11,872,656Core material, electronic component and method for forming bump electrode202411,495,566Core material, electronic component and method for forming bump electrode202211,478,869Method for forming bump electrode substrate2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to SENJU METAL INDUSTRY CO (3)· patent assignee history
2022–2024Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENJU METAL INDUSTRY CO32022–2024
Locations
LocationPatentsSpan
JP32022–2024