Inventor

Benjamin D. Kuiper

Inventor
Detroit, MI, US

Overview

2→
Patents
2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

A61Kprimary
A61KPreparations for medical, dental or toiletry purposes14%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations14%
B29CShaping or joining of plastics14%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering14%
C07KPeptides14%
G06FElectric digital data processing14%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to BOND HIGH PERFORMANCE 3D TECH B V (1)· patent assignee history
2021Patents assigned to UNIV EMORY (1)· patent assignee history
2021Based in Detroit, MI, US· patent location history
2021Based in Enschede, NL· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BOND HIGH PERFORMANCE 3D TECH B V12021
UNIV EMORY12021
Locations
LocationPatentsSpan
Detroit, MI, US12021
Enschede, NL12021