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Inventor

Sandhya Sandireddy

Inventor
Boise, ID, US

Overview

2→
Patents
2009–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,888,188'Method of fabicating a microelectronic die having a curved surface'20117,633,157'Microelectronic devices having a curved surface and methods for manufacturing the same'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2011Patents assigned to MICRON TECHNOLOGY INC (2)· patent assignee history
2009–2011Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC22009–2011
Locations
LocationPatentsSpan
Boise, ID, US22009–2011