Inventor
Cheng-Hung Shih
Inventor
Changhua County, TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices21%
H10HInorganic light-emitting semiconductor devices having potential barriers13%
C01BNon-metallic elements8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds5%
C07DHeterocyclic compounds3%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
H01RElectrically-conductive connections3%
H05KPrinted circuits3%
PatentTitleYear
10,808,331Electroplating system and pressure device thereof202010,797,213Chip package and chip thereof202010,384,941Method for producing spherical silicon nitride powder201910,381,508Light emitting element with an enhanced electroluminescence effect201910,144,645Method for preparing spherical aluminum oxynitride powder20189,508,676'Semiconductor package structure having hollow chamber and bottom substrate and package process thereof'20169,312,440'Epitaxy structure of a light emitting element having III-nitride quantum wells'20169,230,823'Method of photoresist strip'20169,216,906'Method for manufacturing aluminum nitride powder'20159,147,808'III-nitride quantum well structure and a light-emitting unit using the same'20158,916,458'III-nitride quantum well structure, a method for producing the same, and a light-emitting unit using the same'20148,877,629'Semiconductor manufacturing process and structure thereof'20148,783,897'Lamp module with electronic connector adapter'20148,692,390'Pyramid bump structure'20148,581,239'Package structure and semiconductor structure thereof'20138,530,344'Method for manufacturing fine-pitch bumps and structure thereof'20138,501,614'Method for manufacturing fine-pitch bumps and structure thereof'20138,497,579'Semiconductor packaging method and structure thereof'20138,475,939'm-terphenyl compound derivatives and application for organic light emitting diode'20138,450,049'Process for forming an anti-oxidant metal layer on an electronic device'20138,437,142'Bump structure and process of manufacturing the same'20138,330,280'Bump structure and process of manufacturing the same'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2020Patents assigned to CHIPBOND TECHNOLOGY CORP (12)· patent assignee history
2012–2014Patents assigned to SHIH CHENG-HUNG (10)· patent assignee history
2012–2013Based in Hsinchu County, TW· patent location history
2013Patents assigned to HSIEH YUNG-WEI (4)· patent assignee history
2013Patents assigned to LIN SHU-CHEN (4)· patent assignee history
2013Patents assigned to LIN CHENG-FAN (3)· patent assignee history
2013–2020Based in Changhua County, TW· patent location history
2014–2019Based in Kaohsiung, TW· patent location history
2015Based in Taoyuan County, TW· patent location history
2018–2019Based in Taoyuan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHIPBOND TECHNOLOGY CORP | 12 | 2012–2020 |
| SHIH CHENG-HUNGself | 10 | 2012–2014 |
| HSIEH YUNG-WEI | 4 | 2013 |
| LIN SHU-CHEN | 4 | 2013 |
| LIN CHENG-FAN | 3 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Changhua County, TW | 11 | 2013–2020 |
| Kaohsiung, TW | 4 | 2014–2019 |
| Taoyuan, TW | 2 | 2018–2019 |
| Hsinchu County, TW | 2 | 2012–2013 |
| Taoyuan County, TW | 1 | 2015 |