Inventor
Zhan Ping
Inventor
Milpitas, CA, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing45%
G11CStatic stores10%
H05KPrinted circuits10%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use7%
Y10TTechnical subjects covered by former us classification5%
F04DNon-positive-displacement pumps2%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants2%
G05BControl or regulating systems in general2%
G05DSystems for controlling or regulating non-electric variables2%
G06NComputing arrangements based on specific computational models2%
PatentTitleYear
11,003,609Multi-protocol IO infrastructure for a flexible storage platform202110,996,896Solid state drive multi-card adapter with integrated processing202110,824,499Memory system architectures using a separate system control path or channel for processing error information202010,809,780Active disturbance rejection based thermal control202010,776,299Multi-protocol I/O infrastructure for a flexible storage platform202010,747,473Solid state drive multi-card adapter with integrated processing202010,698,460Advanced thermal control for SSD202010,466,923Modular non-volatile flash memory blade201910,365,981Adaptive multipath fabric for balanced performance and high availability201910,360,166Multi-protocol io infrastructure for a flexible storage platform201910,193,377Semiconductor energy harvest and storage system for charging an energy storage device and powering a controller and multi-sensor memory module201910,140,063Solid state drive multi-card adapter with integrated processing201810,114,778Multi-protocol IO infrastructure for a flexible storage platform201810,002,044Memory devices and modules20189,946,664Socket interposer having a multi-modal I/O interface20189,841,904'Scalable and configurable non-volatile memory module array'20179,804,920'Rank and page remapping logic in a volatile memory'20179,348,380'Dynamic thermal budget allocation for memory array'20169,342,136'Dynamic thermal budget allocation for multi-processor systems'20169,338,918'Socket interposer and computer system using the socket interposer'20169,237,670'Socket interposer and computer system using the socket'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to SAMSUNG ELECTRONICS CO LTD (21)· patent assignee history
2016–2018Patents assigned to PING ZHAN (2)· patent assignee history
2016Patents assigned to SAMSUNG ELECTRONICS LTD (2)· patent assignee history
2016Patents assigned to BRENNAN ROBERT (1)· patent assignee history
2016–2021Based in San Jose, CA, US· patent location history
2017–2021Based in Milpitas, CA, US· patent location history
2018Patents assigned to MARRIPUDI GUNNESWARA (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 21 | 2016–2021 |
| PING ZHANself | 2 | 2016–2018 |
| SAMSUNG ELECTRONICS LTD | 2 | 2016 |
| BRENNAN ROBERT | 1 | 2016 |
| MARRIPUDI GUNNESWARA | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Milpitas, California, US | 11 | 2017–2021 |
| San Jose, California, US | 10 | 2016–2021 |