Inventor

Chuan Hu

Inventor

Chandler, AZ, US

Overview

59→

Patents

2004–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 59 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%

H01LSemiconductor devices18%

H05KPrinted circuits10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

Y10TTechnical subjects covered by former us classification9%

H01QAntennas, i.e. radio aerials3%

B23KSoldering or unsoldering2%

G06FElectric digital data processing2%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%

PatentTitleYear

11,010,065Read retry method for solid state storage device2021 10,867,959Integrated circuit packaging method and integrated packaged circuit2020 10,867,961Single layer low cost wafer level packaging for SFF SiP2020 10,847,496Chip wiring method and structure2020 10,615,151Integrated circuit multichip stacked packaging structure and method2020 10,535,634Multi-layer package2020 10,468,367Solder in cavity interconnection structures2019 10,381,288Packaged semiconductor die and CTE-engineering die pair2019 10,256,211Multi-chip-module semiconductor chip package having dense package wiring2019 10,122,089Magnetic nanocomposite materials and passive components formed therewith2018 10,096,535Packaged semiconductor die and CTE-engineering die pair2018 10,014,277Single layer low cost wafer level packaging for SFF SiP2018 9,951,410Infrared surface light source generating device and method of manufacturing same2018 9,942,980Wavy interconnect for bendable and stretchable devices2018 9,930,793'Electric circuit on flexible substrate'2018 9,848,490Solder in cavity interconnection technology2017 9,761,514'Substrate for integrated circuit devices including multi-layer glass core and methods of making the same'2017 9,741,645'Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages'2017 9,685,390'Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer'2017 9,673,131'Integrated circuit package assemblies including a glass solder mask layer'2017 9,659,885'Semiconductor device with pre-molding chip bonding'2017 9,543,197'Package with dielectric or anisotropic conductive (ACF) buildup layer'2017 9,530,747'Solder in cavity interconnection structures'2016 9,508,675'Microelectronic package having direct contact heat spreader and method of manufacturing same'2016 9,461,355'Method apparatus and material for radio frequency passives and antennas'2016 9,420,707'Substrate for integrated circuit devices including multi-layer glass core and methods of making the same'2016 9,281,292'Single layer low cost wafer level packaging for SFF SiP'2016 9,072,187'Off-plane conductive line interconnects in microelectronic devices'2015 9,006,890'Solder in cavity interconnection structures'2015 8,936,967'Solder in cavity interconnection structures'2015 8,872,355'Semiconductor device with pre-molding chip bonding'2014 8,663,485'Method of manufacturing plastic metallized three-dimensional circuit'2014 8,541,876'Microelectronic package having direct contact heat spreader and method of manufacturing same'2013 8,424,748'Solder in cavity interconnection technology'2013 8,080,870'Die-warpage compensation structures for thinned-die devices, and methods of assembling same'2011 7,888,183'Thinned die integrated circuit package'2011 7,882,624'Method of forming electronic package having fluid-conducting channel'2011 7,713,839'Diamond substrate formation for electronic assemblies'2010 7,682,876'Electronic assemblies having a low processing temperature'2010 7,646,093'Thermal management of dies on a secondary side of a package'2010 7,626,251'Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same'2009 7,560,640'Densely packed thermoelectric cooler'2009 7,531,429'Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices'2009 7,495,630'Feed point adjustable planar antenna'2009 7,476,568'Wafer-level assembly of heat spreaders for dual IHS packages'2009 7,420,273'Thinned die integrated circuit package'2008 7,397,119'Wafer-level diamond spreader'2008 7,382,323'Micro chip antenna'2008 7,319,048'Electronic assemblies having a low processing temperature'2008 7,301,461'SOC for integrating micro-antenna'2007 7,279,796'Microelectronic die having a thermoelectric module'2007 7,259,965'Integrated circuit coolant microchannel assembly with targeted channel configuration'2007 7,126,822'Electronic packages, assemblies, and systems with fluid cooling'2006 7,095,111'Package with integrated wick layer and method for heat removal'2006 7,091,108'Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices'2006 7,038,316'Bumpless die and heat spreader lid module bonded to bumped die carrier'2006 7,012,011'Wafer-level diamond spreader'2006 7,009,289'Fluxless die-to-heat spreader bonding using thermal interface material'2006 6,833,289'Fluxless die-to-heat spreader bonding using thermal interface material'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2020Patents assigned to INTEL CORP (50)· patent assignee history

2004–2020Based in Chandler, AZ, US· patent location history

2007–2009Patents assigned to CHANT SINCERE CO LTD (3)· patent assignee history

2007–2021Based in Taipei, TW· patent location history

2009Based in Hsichih, TW· patent location history

2011–2018Patents assigned to HU CHUAN (15)· patent assignee history

2015–2016Patents assigned to LIFF SHAWNA M (3)· patent assignee history

2018Based in New Taipei, TW· patent location history

2020Patents assigned to SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INTEL CORP	50	2004–2020
HU CHUANself	15	2011–2018
CHANT SINCERE CO LTD	3	2007–2009
LIFF SHAWNA M	3	2015–2016
SHENZHEN XIUYUAN ELECTRONIC TECH CO LTD	3	2020

Locations

Location	Patents	Span
Chandler, AZ, US	53	2004–2020
Taipei, TW	4	2007–2021
New Taipei, TW	1	2018
Hsichih, TW	1	2009