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Inventor

Sheng-Chieh Liu

Inventor
Taichung, TW

Overview

3→
Patents
2009–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems33%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
LOC0417%
PatentTitleYear
D0921368Beater bar20217,611,960'Method and system for wafer backside alignment'20097,494,830'Method and device for wafer backside alignment overlay accuracy'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2009Based in Taichung, TW· patent location history
2021Patents assigned to BLACK & DECKER INC (1)· patent assignee history
2021Based in Berkshire, GB· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG22009
BLACK & DECKER INC12021
Locations
LocationPatentsSpan
Taichung, TW22009
Berkshire, GB12021