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Inventor

Haruhiko Yamamoto

Inventor
Yokohama, JP

Overview

37→
Patents
1979–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 37 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G06FElectric digital data processing13%
H05KPrinted circuits11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G11BInformation storage based on relative movement between record carrier and transducer4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B08BCleaning in general3%
B23KSoldering or unsoldering3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for3%
PatentTitleYear
10,875,580Vehicle front structure2020D0870160Bobbin with wound thread2019D0869515Bobbin with wound thread201910,421,424Vehicle front structure20199,310,524'Film deposition apparatus and film deposition method'20168,697,269'Sealed battery'20148,399,804'Method for manufacturing prismatic battery, and laser welding jig and laser welding device for manufacturing the same'20138,352,208'Method for evaluating tree production capacity, image capture device for evaluating tree production capacity, and program for evaluating tree production capacity'20138,207,949'Touch panel, and method for manufacturing touch panel'20128,154,531'Touch panel'20128,031,183'Touch panel and method for manufacturing touch panel'20117,891,452'Automobile rear structure'20117,556,297'Attachment structure of energy absorbing structure'20097,371,659'Substrate laser marking'20086,693,362'Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate'20046,621,707'Liquid-cooled electronic apparatus'20036,545,866'Electronic device'20036,404,640'Liquid-cooled electronic apparatus'20026,333,847'Outside panel for an electronic device'20016,299,723'Anti-airlock apparatus for filters'20016,276,379'Anti-microbubble deposition apparatus'20016,248,180'Method for removing particles from a semiconductor wafer'20016,032,529'Liquid level sensor for buffered hydrofluoric acid'20005,726,492'Semiconductor module including vertically mounted semiconductor chips'19985,195,020'Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer'19935,136,856'Cooling system'19925,126,919'Cooling system for an electronic circuit device'19925,050,037'Liquid-cooling module system for electronic circuit components'19915,012,858'Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit'19914,920,574'Cooling system for an electronic circuit device'19904,879,632'Cooling system for an electronic circuit device'19894,865,123'Apparatus for supplying cooling fluid'19894,783,721'Cooling system for an electronic circuit device'19884,756,473'Cooling method control system for electronic apparatus'19884,729,060'Cooling system for electronic circuit device'19884,313,149'Electronic equipment enclosure connecting structure'19824,158,220'Printed circuit card construction'1979

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1979–2004Patents assigned to FUJITSU LTD (19)· patent assignee history
1979–1993Based in Yokohama, JP· patent location history
1998–2004Based in Kawasaki, JP· patent location history
2000–2008Patents assigned to LSI LOGIC CORP (5)· patent assignee history
2000–2008Based in Tsukuba, JP· patent location history
2009–2020Patents assigned to TOYOTA MOTOR CO LTD (4)· patent assignee history
2011–2016Patents assigned to ULVAC INC (4)· patent assignee history
2011–2016Based in Chigasaki, JP· patent location history
2012–2014Patents assigned to YAMAMOTO HARUHIKO (5)· patent assignee history
2019Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJITSU LTD191979–2004
LSI LOGIC CORP52000–2008
YAMAMOTO HARUHIKOself52012–2014
TOYOTA MOTOR CO LTD42009–2020
ULVAC INC42011–2016
Locations
LocationPatentsSpan
Yokohama, JP131979–1993
Kawasaki, JP61998–2004
Tsukuba, JP52000–2008
Chigasaki, JP42011–2016
Tokyo, JP22019