Inventor
Masahiro Sekiguchi
Inventor
Yokohama, JP
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation22%
G01NInvestigating or analysing materials by determining their chemical or physical properties8%
Y10TTechnical subjects covered by former us classification8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
H04NPictorial communication, e.g. television6%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%
B82YSpecific uses or applications of nanostructures3%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds3%
C09CTreatment of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties3%
PatentTitleYear
8,778,778'Manufacturing method of semiconductor device, semiconductor substrate, and camera module'20148,580,652'Semiconductor device and manufacturing method thereof'20138,338,918'Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package'20128,269,315'Semiconductor device and method of manufacturing semiconductor device'20128,237,285'Semiconductor device, through hole having expansion portion and thin insulating film'20128,228,426'Semiconductor package and camera module'20128,063,462'Semiconductor device and method of manufacturing the same'20117,993,974'Method for manufacturing a semiconductor device'20117,888,778'Semiconductor device and producing method of the same'20117,888,760'Solid state imaging device and method for manufacturing same, and solid state imaging module'20117,808,064'Semiconductor package including through-hole electrode and light-transmitting substrate'20107,244,620'Method for quantitatively determining a reducing substance and a reagent for quantitative determination'20077,198,890'Method for quantitatively determining homocysteine and a reagent for quantitative determination of homocysteine'20076,632,677'Air shutoff agent for aqueous reagent and aqueous specimen, and method for storing aqueous reagent and aqueous specimen with stability'20035,529,720'Low-resistance conductive pigment and method of manufacturing same'19965,518,810'Infrared ray cutoff material and infrared cutoff powder use for same'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996Based in Saitama, JP· patent location history
1996Based in Omiya, JP· patent location history
2003–2007Patents assigned to DAIICHI PURE CHEMICALS CO LTD (3)· patent assignee history
2003–2007Based in Ryugasaki, JP· patent location history
2010–2014Patents assigned to TOSHIBA KK (11)· patent assignee history
2010–2013Based in Yokohama, JP· patent location history
2011–2014Patents assigned to SEKIGUCHI MASAHIRO (7)· patent assignee history
2011–2014Patents assigned to TANIDA KAZUMASA (5)· patent assignee history
2011–2014Based in Kanagawa, JP· patent location history
2012–2013Patents assigned to MATSUO MIE (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 11 | 2010–2014 |
| SEKIGUCHI MASAHIROself | 7 | 2011–2014 |
| TANIDA KAZUMASA | 5 | 2011–2014 |
| DAIICHI PURE CHEMICALS CO LTD | 3 | 2003–2007 |
| MATSUO MIE | 3 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 8 | 2010–2013 |
| Kanagawa, JP | 3 | 2011–2014 |
| Ryugasaki, JP | 3 | 2003–2007 |
| Saitama, JP | 1 | 1996 |
| Omiya, JP | 1 | 1996 |