Inventor
Hao-Han HSU
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Bprimary
H04BTransmission24%
H01FMagnets12%
H01LSemiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B60LPropulsion of electrically-propelled vehicles6%
H01PWaveguides6%
H01QAntennas, i.e. radio aerials6%
H02JElectric power networks6%
H03HImpedance networks, e.g. resonant circuits6%
H04WWireless communication networks6%
PatentTitleYear
12,316,361Signal receiving apparatus and operation method thereof having phase compensation mechanism202511,804,454Package-level noise filtering for EMI RFI mitigation202311,705,934Wireless communication chip that makes both 5 GHz band and 6 GHz band support two transmit and two receive paths202311,283,173Thin chassis near field communication (NFC) antenna integration202211,177,680Field shaper for a wireless power transmitter202111,145,568Magnetically affixed heat spreader2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2022Patents assigned to INTEL CORP (3)· patent assignee history
2021–2023Based in US· patent location history
2023–2025Patents assigned to REALTEK SEMICONDUCTOR CORP (2)· patent assignee history
2023Patents assigned to TAHOE RES LTD (1)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 3 | 2021–2022 |
| REALTEK SEMICONDUCTOR CORP | 2 | 2023–2025 |
| TAHOE RES LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2021–2023 |
| TW | 2 | 2023–2025 |