Inventor
Seiji Kogure
Inventor
Kawasaki, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H05KPrinted circuits23%
Y02PClimate change mitigation technologies in the production or processing of goods23%
Y10TTechnical subjects covered by former us classification15%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
PatentTitleYear
6,727,718'Electronic component package, printed circuit board, and method of inspecting the printed circuit board'20046,498,307'Electronic component package, printing circuit board, and method of inspecting the printed circuit board'20025,337,467'Method of producing wire-bonded substrate assembly'19945,182,853'Method for encapsulting IC chip'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2002Patents assigned to FUJITSU LTD (3)· patent assignee history
1993Based in Nakahara, JP· patent location history
1994–2004Based in Kawasaki, JP· patent location history
2004Patents assigned to FUJISTU LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 3 | 1993–2002 |
| FUJISTU LTD | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 3 | 1994–2004 |
| Nakahara, JP | 1 | 1993 |