Inventor
TYLER LEUTEN
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H05KPrinted circuits20%
H01RElectrically-conductive connections10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
12,237,300Through-substrate void filling for an integrated circuit assembly202512,096,566Reciprocal PCB manufacturing process202411,948,917Die over mold stacked semiconductor package202411,811,182Solderless BGA interconnect202311,646,253Ball interconnect structures for surface mount components202311,562,978Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same202311,495,547Fiber reinforced stiffener202211,399,434Electronic package and method of forming an electronic package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (8)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2022–2025 |