Inventor

TSEZ-CHONG TSAI

Inventor
TW

Overview

3→
Patents
2022–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
B23PMetal-working not otherwise provided for11%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers11%
F16MFrames, casings or beds of engines, machines or apparatus, not specific to engines, machines or apparatus provided for elsewhere11%
G06KGraphical data reading11%
H04WWireless communication networks11%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%
H01JElectric discharge tubes or discharge lamps5%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2022–2024Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32022–2024
Locations
LocationPatentsSpan
TW32022–2024