Inventor

Rio Rivas

Inventor
Corvallis, OR, US

Overview

55→
Patents
2002–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 55 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Jprimary
B41JTypewriters39%
G01NInvestigating or analysing materials by determining their chemical or physical properties10%
H03HImpedance networks, e.g. resonant circuits10%
Y10TTechnical subjects covered by former us classification10%
B05BSpraying apparatus5%
B01LChemical or physical laboratory apparatus for general use4%
B23KSoldering or unsoldering3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
PatentTitleYear
10,828,892Printhead with printer fluid check valve202010,812,045BAW sensor with enhanced surface area active region202010,618,045Sensor device with BAW resonator and through-substrate fluidic vias202010,578,614BAW sensor fluidic device with increased dynamic measurement range202010,533,972Fluidic device with fluid port orthogonal to functionalized active region202010,479,080Fluid ejection device with ink feedhole bridge201910,458,982Fluidic device including BAW resonators along opposing channel surfaces201910,393,704Multi-frequency BAW mixing and sensing system and method201910,369,790Fluid dispenser201910,371,667BAW sensor with passive mixing structures201910,369,788Printhead with recessed slot ends201910,352,904Acoustic resonator devices and methods providing patterned functionalization areas201910,330,643BAW sensing and filtration device and related methods201910,330,642BAW sensor device with peel-resistant wall structure201910,267,770Acoustic resonator devices and methods with noble metal layer for functionalization201910,118,392Fluid feed slot for fluid ejection device201810,099,483Fluid ejection cartridge with controlled adhesive bond201810,086,612Fluid ejection device with ink feedhole bridge201810,005,282Fluid ejection devices with particle tolerant thin-film extensions20189,962,938Fluid feed slot for fluid ejection device20189,895,885'Fluid ejection device with particle tolerant layer extension'20189,776,407'Fluid ejection device with ink feedhole bridge'20179,707,754'Fluid ejection device with particle tolerant layer extension'20179,707,586'Printhead with recessed slot ends'20179,623,657'Fluid dispenser'20179,624,101'Article with controlled wettability'20179,597,873'Printhead protective coating'20179,579,893'Controlling adhesives between substrates and carriers'20179,573,369'Fluid ejection assembly with controlled adhesive bond'20179,498,953'Printhead die with multiple termination rings'20169,475,278'Controlling adhesives between substrates and carriers'20169,463,485'Fluid ejection device'20169,352,568'Fluid ejection device with particle tolerant thin-film extension'20169,211,713'Fluid dispenser'20158,940,559'Method of fabricating an integrated orifice plate and cap structure'20158,870,337'Printhead die with damage detection conductor between multiple termination rings'20148,727,499'Protecting a fluid ejection device resistor'20148,714,710'Print head'20148,585,180'Protective coating for print head feed slots'20138,573,740'Manufacture of a print head'20138,510,948'Methods and systems for forming slots in a semiconductor substrate'20138,434,853'Printhead cap assembly'20138,382,253'Fluid ejection device and methods of fabrication'20138,333,459'Printing device'20128,043,517'Method of forming openings in substrates and inkjet printheads fabricated thereby'20117,942,997'High resolution inkjet printer'20117,807,079'Method of forming orifice plate for fluid ejection device'20107,530,169'Mandrel for electroformation of an orifice plate'20097,377,618'High resolution inkjet printer'20087,040,016'Method of fabricating a mandrel for electroformation of an orifice plate'20066,979,797'Slotted substrates and methods and systems for forming same'20056,930,055'Substrates having features formed therein and methods of forming'20056,857,727'Orifice plate and method of forming orifice plate for fluid ejection device'20056,663,224'Orifice plate with break tabs and method of manufacturing'20036,402,296'High resolution inkjet printer'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2020Based in Corvallis, OR, US· patent location history
2003–2020Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (32)· patent assignee history
2012–2017Patents assigned to RIVAS RIO (15)· patent assignee history
2014–2017Patents assigned to FRIESEN ED (7)· patent assignee history
2016–2017Patents assigned to HEWLETT PACKARD DEVELOPMENT CO LP (11)· patent assignee history
2017–2020Based in Bend, OR, US· patent location history
2019–2020Patents assigned to QORVO US INC (11)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO322003–2020
RIVAS RIOself152012–2017
HEWLETT PACKARD DEVELOPMENT CO LP112016–2017
QORVO US INC112019–2020
FRIESEN ED72014–2017
Locations
LocationPatentsSpan
Corvallis, OR, US412002–2020
Bend, OR, US142017–2020