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Inventor

James Patrick Doyle

Inventor
Bronx, NY, US

Overview

43→
Patents
1977–2019
Patent span
Physics
Primary field (CPC G)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G02Fprimary
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
G01KMeasuring temperature5%
H10NElectric solid-state devices not otherwise provided for5%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
H05KPrinted circuits4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
PatentTitleYear
10,340,182Enhanced via fill material and processing for dual damscene integration20198,241,957'Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging'20128,081,280'Method of producing UV stable liquid crystal alignment'20117,883,919'Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging'20117,579,069'Negative coefficient of thermal expansion particles and method of forming the same'20097,573,130'Crack trapping and arrest in thin film structures'20097,556,979'Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging'20097,491,578'Method of forming crack trapping and arrest in thin film structures'20097,491,965'Heat-shielded low power PCM-based reprogrammable eFUSE device'20097,417,315'Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging'20087,394,089'Heat-shielded low power PCM-based reprogrammable EFUSE device'20087,316,831'Tilted vertical alignment of liquid crystals employing inorganic thin film composition and ion beam treatment'20087,097,884'Stability of ion beam generated alignment layers by surface modification'20066,954,247'Multi-domain low twist angle liquid crystal cells and methods of production thereof'20056,866,415'Scanning heat flow probe'20056,817,761'Scanning heat flow probe'20046,731,361'High resolution in-plane switching mode TFT-LCD'20046,724,449'Vertical aligned liquid crystal display and method using dry deposited alignment layer films'20046,682,786'Liquid crystal display cell having liquid crystal molecules in vertical or substantially vertical alignment'20046,679,625'Scanning heat flow probe'20046,665,033'Method for forming alignment layer by ion beam surface modification'20036,660,341'Tilted vertical alignment of liquid crystals employing inorganic thin film composition and ion beam treatment'20036,652,139'Scanning heat flow probe and the method of fabricating the same'20036,654,089'Maskless method and system for creating a dual-domain pattern on a diamond-like carbon alignment layer'20036,632,483'Ion gun deposition and alignment for liquid-crystal applications'20036,613,602'Method and system for forming a thermoelement for a thermoelectric cooler'20036,593,586'Method and apparatus for making a crystal alignment layer'20036,583,847'Self alignment of substrates by magnetic alignment'20036,577,365'Method and apparatus to form liquid crystal alignment layer'20036,542,216'System and method for producing thin film patterns interspersed with voids to admit light to otherwise shadowed regions'20036,467,725'Electrical generator an aero-engine including such a generator, and an aircraft including such a generator'20026,384,312'Thermoelectric coolers with enhanced structured interfaces'20026,331,381'Method for making a liquid crystal alignment layer'20016,180,291'Static resistant reticle'20016,147,730'Color filters formed sequentially with intervening protective films for flat panel displays'20006,061,114'Alignment of liquid crystal layers'20006,020,946'Dry processing for liquid-crystal displays using low energy ion bombardment'20005,984,504'Safety or protection system employing reflective memory and/or diverse processors and communications'19995,182,230'Laser methods for circuit repair on integrated circuits and substrates'19935,171,709'Laser methods for circuit repair on integrated circuits and substrates'19924,878,605'Load carrying apparatus'1989D0283961'Toothbrush holder'19864,035,712'Electrical generating apparatus'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–2002Patents assigned to LUCAS INDUSTRIES LTD (2)· patent assignee history
1989Based in Wisonsin Dells, WI, US· patent location history
1992–2019Patents assigned to IBM (38)· patent assignee history
1992–2012Based in Bronx, NY, US· patent location history
1999Based in North Versailles, PA, US· patent location history
2002Based in Hemel Hempstead, GB· patent location history
2011–2012Patents assigned to DOYLE JAMES PATRICK (2)· patent assignee history
2011Patents assigned to CHIU GEORGE LIANG-TAI (1)· patent assignee history
2012Patents assigned to CHEY S JAY (1)· patent assignee history
2019Based in Armonk, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM381992–2019
DOYLE JAMES PATRICKself22011–2012
LUCAS INDUSTRIES LTD21977–2002
CHEY S JAY12012
CHIU GEORGE LIANG-TAI12011
Locations
LocationPatentsSpan
Bronx, New York, US371992–2012
Armonk, New York, US12019
Hemel Hempstead, GB12002
North Versailles, Pennsylvania, US11999
Wisonsin Dells, WI, US11989