Inventor
Kei Nakamura
Inventor
Osaka, JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H01LSemiconductor devices8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%
Y10TTechnical subjects covered by former us classification8%
G03GElectrography6%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
G06FElectric digital data processing4%
LOC244%
PatentTitleYear
10,976,684Developer carrying member, process cartridge, and electrophotographic apparatus202110,498,996Pixel control signal verification in a stacked image sensor201910,032,948Solar battery module20189,666,740'Solar cell module manufacturing method'2017D0785163'Injection tool'20179,530,919'Solar cell module'2016D0760891'Injection tool'20168,456,343'Switched capacitor type D/A converter'20138,452,138'Optical sensor module'20138,378,226'Wired circuit board'20138,330,054'Printed circuit board and magnetic head driving device including the same'20128,092,696'Method for manufacturing printed circuit board'20127,933,529'Image forming apparatus, method for controlling image forming apparatus, fixing apparatus'20117,894,736'Image forming apparatus including control for main and auxiliary heating members'20117,787,788'Fixing device and image forming apparatus including fixing device'20107,577,485'Automobile manufacturing line input order planning apparatus'20097,561,434'Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon'20097,551,452'Printed circuit board'20096,887,560'Multilayer flexible wiring circuit board and its manufacturing method'20056,851,599'Method for producing multilayer wiring circuit board'20056,462,282'Circuit board for mounting bare chip'20026,373,000'Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board'20026,335,076'Multi-layer wiring board and method for manufacturing the same'20026,333,469'Wafer-scale package structure and circuit board attached thereto'20016,310,391'Mounted structure of circuit board and multi-layer circuit board therefor'20016,258,449'Low-thermal expansion circuit board and multilayer circuit board'20015,437,047'System for gathering and safeguarding program run information of each individual processor by transferring information to an external storage'19955,386,544'Data processing system with a standby process mechanism for saving and restoring operations'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995Patents assigned to FUJITSU LTD (2)· patent assignee history
2001–2013Patents assigned to NITTO DENKO CORP (14)· patent assignee history
2001–2018Based in Osaka, JP· patent location history
2009–2013Based in Ibaraki, JP· patent location history
2009–2011Based in Tokyo, JP· patent location history
2010–2011Based in Machida, JP· patent location history
2012–2013Patents assigned to NAKAMURA KEI (5)· patent assignee history
2016–2018Patents assigned to PANASONIC IP MAN CO LTD (3)· patent assignee history
2016–2017Patents assigned to ABBVIE INC (2)· patent assignee history
2016–2017Based in Fuchu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 14 | 2001–2013 |
| NAKAMURA KEIself | 5 | 2012–2013 |
| PANASONIC IP MAN CO LTD | 3 | 2016–2018 |
| ABBVIE INC | 2 | 2016–2017 |
| FUJITSU LTD | 2 | 1995 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 13 | 2001–2018 |
| Ibaraki, JP | 4 | 2009–2013 |
| Fuchu, JP | 2 | 2016–2017 |
| Tokyo, JP | 2 | 2009–2011 |
| Machida, JP | 2 | 2010–2011 |