Inventor

KUNAL R. PAREKH

Inventor

US

Overview

2022–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 71 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices25%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%

H10BElectronic memory devices19%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%

H10DInorganic electric semiconductor devices9%

G11CStatic stores8%

G06FElectric digital data processing3%

G16BBioinformatics, i.e. information and communication technology [ict] specially adapted for genetic or protein-related data processing in computational molecular biology3%

H10NElectric solid-state devices not otherwise provided for1%

H05KPrinted circuits0%

PatentTitleYear

12,555,625Input/output connections of wafer-on-wafer bonded memory and logic2026 12,538,821Signal routing structures including a plurality of parallel conductive lines and semiconductor device assemblies including the same2026 12,532,461Microelectronic devices and electronic systems2026 12,525,509Nano through substrate vias for semiconductor devices and related systems and methods2026 12,471,282Microelectronic devices, memory devices, and 3D NAND flash memory devices2025 12,439,592Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems2025 12,437,832Repair techniques for coupled memory dies2025 12,424,590Semiconductor device assemblies and associated methods2025 12,424,517Monolithic conductive cylinder in a semiconductor device and associated methods2025 12,424,516Monolithic conductive column in a semiconductor device and associated methods2025 12,387,780Testing memory of wafer-on-wafer bonded memory and logic2025 12,381,131Front end of line interconnect structures and associated systems and methods2025 12,368,096Microelectronic devices with through-substrate interconnects and associated methods of manufacturing2025 12,362,243Semiconductor device assemblies including TSVs of different lengths and methods of making the same2025 12,363,895Integrated assemblies and methods of forming integrated assemblies2025 12,354,649Signal routing between memory die and logic die for performing operations2025 12,334,448Front end of line interconnect structures and associated systems and methods2025 12,261,111Memory devices and related methods of forming a memory device2025 12,243,610Memory with parallel main and test interfaces2025 12,205,846Methods of forming microelectronic devices, and related electronic systems2025 12,205,865Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same2025 12,199,0703D NAND memory device devices and related electronic systems2025 12,185,537Integrated structures2024 12,183,716Monolithic conductive columns in a semiconductor device and associated methods2024 12,165,696Signal routing between memory die and logic die2024 12,167,602Integrated assemblies having thicker semiconductor material along one region of a conductive structure than along another region, and methods of forming integrated assemblies2024 12,154,893Base structures for microelectronic devices2024 12,112,792Memory device for wafer-on-wafer formed memory and logic2024 12,112,793Signal routing between memory die and logic die for mode based operations2024 12,107,050Front end of line interconnect structures and associated systems and methods2024 12,096,6263D NAND flash memory devices, and related electronic systems2024 12,089,403Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells2024 12,089,422Microelectronic devices, and related methods and memory devices2024 12,080,700Microelectronic devices including control logic regions2024 12,074,094Monolithic conductive column in a semiconductor device and associated methods2024 12,068,272Microelectronic devices having a memory array region, a control logic region, and signal routing structures2024 12,058,853Electronic devices including capacitors and related methods2024 12,052,863Memory circuitry comprising a vertical string of memory cells and a conductive via and method used in forming a vertical string of memory cells and a conductive via2024 12,046,582Methods of forming microelectronic devices including source structures overlying stack structures2024 12,029,032Integrated assemblies and methods of forming integrated assemblies2024 11,996,377Microelectronic devices and electronic systems2024 11,978,656Semiconductor with through-substrate interconnect2024 11,937,429Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus2024 11,929,323Methods of forming a microelectronic device2024 11,915,742Wafer-on-wafer formed memory and logic for genomic annotations2024 11,862,569Front end of line interconnect structures and associated systems and methods2024 11,842,990Microelectronic devices and electronic systems2023 11,837,594Microelectronic devices and electronic systems2023 11,825,658Methods of forming microelectronic devices and memory devices2023 11,817,305Front end of line interconnect structures and associated systems and methods2023 11,785,764Methods of forming microelectronic devices2023 11,770,932Methods of forming microelectronic devices2023 11,751,408Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems2023 11,710,724Methods of forming microelectronic devices, and related microelectronic devices and electronic systems2023 11,705,367Methods of forming microelectronic devices, and related microelectronic devices, memory devices, electronic systems, and additional methods2023 11,699,652Microelectronic devices and electronic systems2023 11,696,443Integrated assemblies having thicker semiconductor material along one region of a conductive structure than along another region, and methods of forming integrated assemblies2023 11,631,684Integrated assemblies and methods of forming integrated assemblies2023 11,587,919Microelectronic devices, related electronic systems, and methods of forming microelectronic devices2023 11,563,018Microelectronic devices, and related methods, memory devices, and electronic systems2023 11,557,569Microelectronic devices including source structures overlying stack structures, and related electronic systems2023 11,545,456Microelectronic devices, electronic systems having a memory array region and a control logic region, and methods of forming microelectronic devices2023 11,527,436Microelectronic devices with through-substrate interconnects and associated methods of manufacturing2022 11,482,538Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems2022 11,380,669Methods of forming microelectronic devices2022 11,348,933Integrated assemblies having anchoring structures proximate stacked memory cells, and methods of forming integrated assemblies2022 11,335,602Methods of forming microelectronic devices, and related microelectronic devices and electronic systems2022 11,316,107Semiconductor devices and related methods2022 11,282,815Methods of forming microelectronic devices, and related microelectronic devices and electronic systems2022 11,271,002Methods used in forming a memory array comprising strings of memory cells2022 11,239,252Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorus2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to MICRON TECHNOLOGY INC (66)· patent assignee history

2022–2026Based in US· patent location history

2024–2025Patents assigned to LODESTAR LICENSING GROUP LLC (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MICRON TECHNOLOGY INC	66	2022–2026
LODESTAR LICENSING GROUP LLC	5	2024–2025

Locations

Location	Patents	Span
US	71	2022–2026