Inventor

Tomoaki Kudaishi

Inventor

Kodaira, JP

Overview

2001–2011

Patent span

Electricity

Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1049%

Y10TTechnical subjects covered by former us classification28%

H05KPrinted circuits9%

B26BHand-held cutting tools not otherwise provided for7%

H03FAmplifiers5%

Y02PClimate change mitigation technologies in the production or processing of goods2%

PatentTitleYear

7,995,984'Semiconductor device'2011 7,962,105'RF power module'2011 7,706,756'RF power module'2010 7,420,284'Semiconductor device and manufacturing method thereof'2008 7,223,636'Manufacturing method of semiconductor device and semiconductor device'2007 7,091,620'Semiconductor device and manufacturing method thereof'2006 6,875,631'Semiconductor device and a method of manufacturing the same'2005 6,759,754'Semiconductor device and its manufacturing method'2004 6,670,215'Semiconductor device and manufacturing method thereof'2003 6,664,135'Method of manufacturing a ball grid array type semiconductor package'2003 6,642,083'Semiconductor device and manufacturing method thereof'2003 6,639,323'Semiconductor device and its manufacturing method'2003 6,521,981'Semiconductor device and manufacturing method thereof'2003 6,515,371'Semiconductor device with elastic structure and wiring'2003 6,472,727'Semiconductor device and manufacturing method thereof'2002 6,365,439'Method of manufacturing a ball grid array type semiconductor package'2002 6,355,975'Semiconductor device and manufacturing method thereof'2002 6,355,500'Semiconductor device and manufacturing method thereof'2002 6,353,255'Semiconductor device and manufacturing method thereof'2002 6,342,726'Semiconductor device and manufacturing method thereof'2002 6,342,728'Semiconductor device and manufacturing method thereof'2002 6,307,269'Semiconductor device with chip size package'2001 6,169,325'Semiconductor device'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2003Patents assigned to HITACHI LTD (13)· patent assignee history

2001–2005Patents assigned to HITACHI ULSI SYS CO LTD (8)· patent assignee history

2001–2003Patents assigned to AKITA ELECTRONICS CO LTD (3)· patent assignee history

2001–2005Based in Kodaira, JP· patent location history

2002–2003Patents assigned to HITACHI ULSI ENG CORP (2)· patent assignee history

2003–2010Patents assigned to RENESAS TECH CORP (7)· patent assignee history

2006–2008Based in Komoro, JP· patent location history

2010–2011Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI LTD	13	2001–2003
HITACHI ULSI SYS CO LTD	8	2001–2005
RENESAS TECH CORP	7	2003–2010
AKITA ELECTRONICS CO LTD	3	2001–2003
HITACHI ULSI ENG CORP	2	2002–2003

Locations

Location	Patents	Span
Kodaira, JP	17	2001–2005
Tokyo, JP	3	2010–2011
Komoro, JP	3	2006–2008