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Inventor

SEIYA TAKAHASHI

Inventor
JP

Overview

2→
Patents
2023–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

A61Bprimary
A61BDiagnosis20%
B23KSoldering or unsoldering20%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form20%
H05KPrinted circuits20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
12,533,748Laser welding device and laser welding method202611,800,654Device having circuit members between overlapping sealing members2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to JAPAN AVIATION ELECTRONICS IND LTD (1)· patent assignee history
2023–2026Based in JP· patent location history
2026Patents assigned to DELTA KOGYO CO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DELTA KOGYO CO12026
JAPAN AVIATION ELECTRONICS IND LTD12023
Locations
LocationPatentsSpan
JP22023–2026