Inventor
Ji Hun Lee
Inventor
Seoul, KR
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy5%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
H01GCapacitors3%
C03CChemical composition of glasses, glazes or vitreous enamels2%
C07DHeterocyclic compounds2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
G06FElectric digital data processing2%
PatentTitleYear
10,867,984Method of manufacturing a package-on-package type semiconductor package202010,756,389Method for the manufacture of fluorinated cyclic carbonates and their use for lithium ion batteries202010,741,788Display device202010,649,627Electronic device and method for displaying history of executed application thereof202010,629,951Electrolyte composition and a sodium ion battery comprising the same202010,553,451Semiconductor device and manufacturing method thereof202010,388,582Semiconductor device and manufacturing method thereof201910,297,466Semiconductor device and manufacturing method thereof201910,290,621Method of manufacturing a package-on-package type semiconductor package201910,176,935Electrolyte composition comprising fluorinated carbonate, and battery comprising the same201910,034,085Class-D amplifier, audio processing apparatus and method of driving class-D amplifier201810,008,393Semiconductor device and manufacturing method thereof20189,966,276Semiconductor device and manufacturing method thereof20189,941,180Semiconductor device and manufacturing method thereof20189,741,701'Method of manufacturing a package-on-package type semiconductor package'20179,627,353'Method of manufacturing a semiconductor package'20179,536,858'Semiconductor device and manufacturing method thereof'20179,437,575'Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives'20169,403,713'Glass composition for high-reliability ceramic phosphor plate and ceramic phosphor'20169,196,601'Semiconductor device'20159,000,586'Semiconductor device and manufacturing method thereof'20157,940,589'Bit line sense amplifier of semiconductor memory device and control method thereof'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2011–2020Based in Seoul, KR· patent location history
2015–2020Patents assigned to AMKOR TECHNOLOGY INC (14)· patent assignee history
2016Patents assigned to DAE JOO ELECTRONIC MAT CO LTD (1)· patent assignee history
2016Based in Anyang-si, KR· patent location history
2018Based in Daejeon, KR· patent location history
2019–2020Patents assigned to SOLVAY (3)· patent assignee history
2019–2020Based in Gwangju-si, KR· patent location history
2020Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (1)· patent assignee history
2020Based in Anseong-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 14 | 2015–2020 |
| SOLVAY | 3 | 2019–2020 |
| SAMSUNG ELECTRONICS CO LTD | 2 | 2011–2020 |
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 1 | 2020 |
| DAE JOO ELECTRONIC MAT CO LTD | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 17 | 2011–2020 |
| Gwangju-si, KR | 2 | 2019–2020 |
| Anseong-si, KR | 1 | 2020 |
| Daejeon, KR | 1 | 2018 |
| Anyang-si, KR | 1 | 2016 |