Inventor
Hsin-Hui Hsu
Inventor
Hsinchu, TW
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices20%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H01LSemiconductor devices6%
H10DInorganic electric semiconductor devices6%
Y10TTechnical subjects covered by former us classification5%
G02BOptical elements, systems or apparatus4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
C22CAlloys2%
C23CCoating metallic material2%
PatentTitleYear
10,418,458Semiconductor device and manufacturing method therefor201910,283,612Semiconductor device and manufacturing method therefor20199,941,379Semiconductor device and manufacturing method therefor20189,783,409'Micro-electro-mechanical system device and micro-electro-mechanical system compensation structure'20179,660,555'Micro-electro-mechanical system device with enhanced structural strength'20179,302,907'Micro-electro-mechanical-system device with guard ring and method for making same'20169,302,901'Micro-electro-mechanical system device with enhanced structural strength'20169,018,718'Micro-electro-mechanical-system device with guard ring and method for making same'20159,000,544'MEMS package structure'20158,952,463'MEMS structure preventing stiction'20158,829,628'MEMS package structure'20148,729,660'MEMS integrated chip with cross-area interconnection'20148,704,331'MEMS integrated chip with cross-area interconnection'20148,692,338'Micro electronic device having CMOS circuit and MEMS resonator formed on common silicon substrate'20148,679,886'Microelectronic device and MEMS package structure and fabricating method thereof'20148,513,041'MEMS integrated chip and method for making same'20138,372,563'MEMS lithography mask with improved tungsten deposition topography and method for the same'20138,372,675'Microelectronic device and fabricating method thereof and MEMS package structure and fabricating method thereof'20138,368,005'Optical detection method and optical MEMS detector, and method for making MEMS detector'20138,329,492'Micro electronic device and method for fabricating micro electromechanical system resonator thereof'20128,309,165'Color filter by copper and silver film and method for making same'20128,247,253'MEMS package structure and method for fabricating the same'20128,221,888'Color filter by copper and silver film and method for making same'20128,191,231'Method for manufacturing antenna'20128,183,650'MEMS device and MEMS spring element'20128,176,621'Method for forming antenna structure'20128,174,056'Substrate-level interconnection and micro-electro-mechanical system'20128,054,613'Supporting device and a portable electronic device'20117,759,256'Micro-electro-mechanical system device and method for making same'20106,368,964'Method for reducing resistance in a conductor'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2019Based in Hsinchu, TW· patent location history
2010–2019Patents assigned to PIXART IMAGING INC (24)· patent assignee history
2011–2012Patents assigned to WISTRON NEWEB CORP (3)· patent assignee history
2011Based in Taipei, TW· patent location history
2012–2017Patents assigned to HSU HSIN-HUI (18)· patent assignee history
2012–2015Patents assigned to WANG CHUAN-WEI (12)· patent assignee history
2012–2015Patents assigned to LEE SHENG-TA (11)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PIXART IMAGING INC | 24 | 2010–2019 |
| HSU HSIN-HUIself | 18 | 2012–2017 |
| WANG CHUAN-WEI | 12 | 2012–2015 |
| LEE SHENG-TA | 11 | 2012–2015 |
| WISTRON NEWEB CORP | 3 | 2011–2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 29 | 2002–2019 |
| Taipei, TW | 1 | 2011 |