Inventor
WAI LEE
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G01NInvestigating or analysing materials by determining their chemical or physical properties8%
G01RMeasuring electric variables8%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
12,568,843Film covers for sensor packages202612,464,827Resistor with exponential-weighted trim202511,972,994Film covers for sensor packages202411,953,460Monolithic humidity sensor devices and methods of manufacture202411,885,834Magnetic current sensing202411,658,083Film covers for sensor packages2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TEXAS INSTRUMENTS INC (6)· patent assignee history
2023–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 6 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2023–2026 |