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Inventor

Chong Un Tan

Inventor
Shanghai, CN

Overview

4→
Patents
2005–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01LSemiconductor devices27%
H10DInorganic electric semiconductor devices18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
PatentTitleYear
10,418,334Semiconductor device including corner recess201910,276,546Semiconductor device with die tilt control201910,128,218Semiconductor device including die bond pads at a die edge20186,864,423'Bump chip lead frame and package'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005Patents assigned to SEMICONDUCTOR COMPONENT IND L (1)· patent assignee history
2005Based in Negeri Sembilan, MY· patent location history
2018–2019Patents assigned to SANDISK SEMICONDUCTOR SHANGHAI CO LTD (3)· patent assignee history
2018–2019Based in Shanghai, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SANDISK SEMICONDUCTOR SHANGHAI CO LTD32018–2019
SEMICONDUCTOR COMPONENT IND L12005
Locations
LocationPatentsSpan
Shanghai, CN32018–2019
Negeri Sembilan, MY12005