Inventor
NAN-CHUN LIN
Inventor
TW
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01LSemiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
H01QAntennas, i.e. radio aerials5%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles1%
G02BOptical elements, systems or apparatus1%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein1%
G09GArrangements or circuits for control of indicating devices using static means to present variable information1%
H05BElectric heating1%
H10DInorganic electric semiconductor devices1%
PatentTitleYear
12,599,014Package device and manufacturing method thereof202612,558,962Electronic device and vehicle system202612,400,979Integrated antenna package structure and manufacturing method thereof202512,154,863Fan-out semiconductor package and method for manufacturing the same202411,973,037Package structure and manufacturing method thereof202411,916,035Package structure and manufacturing method thereof202411,769,763Package structure and manufacturing method thereof202311,670,611Semiconductor package comprising plurality of bumps and fabricating method202311,637,071Package structure including multiple dies surrounded by conductive element and manufacturing method thereof202311,569,210Package structure having a first connection circuit and manufacturing method thereof202311,557,533Package structure and manufacturing method thereof202311,545,423Package structure and manufacturing method thereof202311,545,424Package structure and manufacturing method thereof202311,532,575Integrated antenna package structure and manufacturing method thereof202211,456,243Semiconductor package structure and manufacturing method thereof202211,367,678Package structure and manufacturing method thereof202211,309,296Semiconductor package and manufacturing method thereof202211,309,283Packaging structure and manufacturing method thereof202211,296,041Integrated antenna package structure and manufacturing method thereof202211,257,747Semiconductor package with conductive via in encapsulation connecting to conductive element202211,251,170Package structure and manufacturing method thereof202211,211,350Semiconductor package and manufacturing method thereof202111,211,321Package structure and manufacturing method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to POWERTECH TECHNOLOGY INC (21)· patent assignee history
2021–2026Based in TW· patent location history
2026Patents assigned to CARUX TECH PTE LTD (1)· patent assignee history
2026Patents assigned to POWERTECH TECH INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| POWERTECH TECHNOLOGY INC | 21 | 2021–2025 |
| CARUX TECH PTE LTD | 1 | 2026 |
| POWERTECH TECH INC | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 23 | 2021–2026 |