Inventor
Stuart L. Roberts
Inventor
Boise, ID, US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1069%
B23KSoldering or unsoldering15%
G01RMeasuring electric variables8%
H01LSemiconductor devices8%
PatentTitleYear
8,987,885'Packaged microdevices and methods for manufacturing packaged microdevices'20158,354,301'Packaged microdevices and methods for manufacturing packaged microdevices'20137,977,597'Wire bonders and methods of wire-bonding'20117,868,440'Packaged microdevices and methods for manufacturing packaged microdevices'20117,229,905'Alignment and orientation features for a semiconductor package'20077,227,095'Wire bonders and methods of wire-bonding'20076,869,869'Alignment and orientation features for a semiconductor package'20056,628,136'Method and apparatus for testing a semiconductor package'20036,577,019'Alignment and orientation features for a semiconductor package'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2015Patents assigned to MICRON TECHNOLOGY INC (9)· patent assignee history
2003–2015Based in Boise, ID, US· patent location history
2013Patents assigned to FOGAL RICH (1)· patent assignee history
2013Patents assigned to REYNOLDS TRACY V (1)· patent assignee history
2013Patents assigned to ROBERTS STUART L (1)· patent assignee history
2013Patents assigned to SCHWAB MATT E (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 9 | 2003–2015 |
| FOGAL RICH | 1 | 2013 |
| REYNOLDS TRACY V | 1 | 2013 |
| ROBERTS STUART Lself | 1 | 2013 |
| SCHWAB MATT E | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 9 | 2003–2015 |