Inventor
Yu Chen
Inventor
Singapore, SG
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B01Lprimary
B01LChemical or physical laboratory apparatus for general use18%
G01NInvestigating or analysing materials by determining their chemical or physical properties8%
B01DSeparation4%
B29CShaping or joining of plastics4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
G06FElectric digital data processing4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
11,080,918Method and system for predicting garment attributes using deep learning202111,070,527Securing platform link with encryption202111,047,155Concealed anti-tamper device202110,758,866Isolation chip and manufacturing method of the same202010,758,867Isolation device and isolation method2020D0878942High pressure detector202010,281,637Pixel structure comprising a wavelength conversion layer and a light collimating layer having a reflection part and a transmission part and display panel having the same20198,080,411'Shallow multi-well plastic chip for thermal multiplexing'20117,547,381'Sensor array integrated electrochemical chip, method of forming same, and electrode coating'20097,442,542'Shallow multi-well plastic chip for thermal multiplexing'20086,846,725'Wafer-level package for micro-electro-mechanical systems'20056,808,644'Capillary with glass internal surface'20046,716,661'Process to fabricate an integrated micro-fluidic system on a single wafer'20046,521,447'Miniaturized thermal cycler'20036,509,186'Miniaturized thermal cycler'20036,503,847'Room temperature wafer-to-wafer bonding by polydimethylsiloxane'20036,432,695'Miniaturized thermal cycler'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2005Patents assigned to INST OF MICROELECTRONICS (7)· patent assignee history
2002–2011Patents assigned to UNIV SINGAPORE (5)· patent assignee history
2002–2011Based in Singapore, SG· patent location history
2008–2011Patents assigned to AGENCY SCIENCE TECH & RES (3)· patent assignee history
2019–2021Based in Hsinchu, TW· patent location history
2020Patents assigned to SHENZHEN WELLSIM BIOMEDICAL TECH (2)· patent assignee history
2020Patents assigned to WELLSIM BIOMEDICAL TECH INC (2)· patent assignee history
2020Based in Shenzhen, CN· patent location history
2021Based in London, GB· patent location history
2021Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INST OF MICROELECTRONICS | 7 | 2002–2005 |
| UNIV SINGAPORE | 5 | 2002–2011 |
| AGENCY SCIENCE TECH & RES | 3 | 2008–2011 |
| SHENZHEN WELLSIM BIOMEDICAL TECH | 2 | 2020 |
| WELLSIM BIOMEDICAL TECH INC | 2 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 10 | 2002–2011 |
| Hsinchu, TW | 2 | 2019–2021 |
| Shenzhen, CN | 2 | 2020 |
| London, GB | 1 | 2021 |
| Chandler, AZ, US | 1 | 2021 |