Inventor
LI-WEI CHOU
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices32%
H01LSemiconductor devices26%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
C03CChemical composition of glasses, glazes or vitreous enamels5%
H05KPrinted circuits5%
PatentTitleYear
12,439,657Confined source/drain epitaxy regions and method forming same202512,363,993Semiconductor device having merged epitaxial features with arc-like bottom surface and method of making the same202512,291,479Textured glass articles and methods of making the same202512,142,560Semiconductor packages and methods of forming same202411,948,971Confined source/drain epitaxy regions and method forming same202411,908,742Semiconductor device having merged epitaxial features with arc-like bottom surface and method of making the same202411,769,771FinFET device having flat-top epitaxial features and method of making the same202311,276,693FinFET device having flat-top epitaxial features and method of making the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
2025Patents assigned to CORNING INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 7 | 2022–2025 |
| CORNING INC | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2022–2025 |