Inventor
KLAUS SCHIESS
Inventor
DE
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10DInorganic electric semiconductor devices19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
12,412,815Semiconductor package and method of manufacturing a semiconductor package202511,923,276Semiconductor device including a bidirectional switch202411,676,881Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package202311,605,577Semiconductor device including a bidirectional switch202311,289,436Semiconductor package having a laser-activatable mold compound202211,217,510Semiconductor device including a bidirectional switch2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (5)· patent assignee history
2022–2025Based in DE· patent location history
2023Patents assigned to INFINEON TECHNOLOGIES AG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AUSTRIA AG | 5 | 2022–2025 |
| INFINEON TECHNOLOGIES AG | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 6 | 2022–2025 |