Inventor

KAZUHIDE NAKAMURA

Inventor
JP

Overview

17→
Patents
2021–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics33%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering33%
Y02PClimate change mitigation technologies in the production or processing of goods13%
B22FWorking metallic powder10%
B28BShaping clay or other ceramic compositions6%
G05BControl or regulating systems in general4%
B29BPreparation or pretreatment of the material to be shaped2%
PatentTitleYear
12,552,101Three-dimensional shaping device and method of manufacturing three-dimensional shaped object202612,403,657Three-dimensional shaping device202512,240,171Material dispense device, three-dimensional shaping device, and injection molding device202511,787,111Shaping material supply device and three-dimensional shaping apparatus202311,718,042Three-dimensional modeling apparatus and method for controlling three-dimensional modeling apparatus202311,701,837Three-dimensional shaping apparatus and control method for three-dimensional shaping apparatus202311,697,159Three-dimensional shaping device and method for manufacturing three-dimensional shaped object202311,691,340Three-dimensional modeling apparatus and three-dimensional modeling method202311,577,470Three-dimensional shaping apparatus202311,548,231Three-dimensional modeling apparatus and method for controlling three-dimensional modeling apparatus202311,534,976Three-dimensional shaping apparatus and control method for three-dimensional shaping apparatus202211,485,061Plasticization device, three-dimensional shaping device, and injection molding device202211,440,227Plasticization device, three-dimensional shaping device, and injection molding device202211,370,1683D modeling device and 3D modeling method202211,292,183Manufacturing method and forming apparatus of three-dimensional formed object202211,186,037Manufacturing method and forming apparatus of three-dimensional formed object202111,179,889Three-dimensional forming system, data generating apparatus, method of generating data, and program2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to SEIKO EPSON CORP (17)· patent assignee history
2021–2026Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SEIKO EPSON CORP172021–2026
Locations
LocationPatentsSpan
JP172021–2026