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Inventor

Sari Wacks

Inventor
Forest Hills, NY, US

Overview

1→
Patents
1994
Patent span
Electricity
Primary field (CPC H)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
5,277,749'Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994Patents assigned to IBM (1)· patent assignee history
1994Based in Forest Hills, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM11994
Locations
LocationPatentsSpan
Forest Hills, New York, US11994