Inventor
Yangming LIU
Inventor
CN
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
G06FElectric digital data processing6%
H01HElectric switches6%
H05KPrinted circuits6%
H10BElectronic memory devices6%
PatentTitleYear
12,033,958Semiconductor device including a suspended reinforcing layer and method of manufacturing same202411,985,782Enclosure fitting for electronic device202411,978,713Flip chip bump with multi-PI opening202411,961,778Semiconductor device package having multi-layer molding compound and method202411,393,735Semiconductor device including reinforced corner supports202211,177,242Semiconductor device including magnetic hold-down layer202111,177,239Semiconductor device including control switches to reduce pin capacitance2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to WESTERN DIGITAL TECH INC (6)· patent assignee history
2021Patents assigned to SANDISK INFORMATION TECH SHANGHAI CO LTD (1)· patent assignee history
2021–2024Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WESTERN DIGITAL TECH INC | 6 | 2021–2024 |
| SANDISK INFORMATION TECH SHANGHAI CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 7 | 2021–2024 |