Inventor
Kan Kinouchi
Inventor
Okazaki, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1056%
H05KPrinted circuits44%
PatentTitleYear
8,179,688'Semiconductor device'20127,843,700'Semiconductor device'20106,731,001'Semiconductor device including bonded wire based to electronic part and method for manufacturing the same'20046,434,006'Semiconductor device having heat radiating member'20026,172,424'Resin sealing type semiconductor device'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2012Patents assigned to DENSO CORP (5)· patent assignee history
2001–2012Based in Okazaki, JP· patent location history
2012Patents assigned to AKAMA SADAHIRO (1)· patent assignee history
2012Patents assigned to FUKUDA YUTAKA (1)· patent assignee history
2012Patents assigned to IMAIZUMI NORIHISA (1)· patent assignee history
2012Patents assigned to KINOUCHI KAN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DENSO CORP | 5 | 2001–2012 |
| AKAMA SADAHIRO | 1 | 2012 |
| FUKUDA YUTAKA | 1 | 2012 |
| IMAIZUMI NORIHISA | 1 | 2012 |
| KINOUCHI KANself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Okazaki, JP | 5 | 2001–2012 |