Inventor
Christian Witt
Inventor
Woodbridge, CT, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H01LSemiconductor devices15%
C09DCoating compositions, e.g. paints, varnishes or lacquers9%
C23CCoating metallic material9%
H05KPrinted circuits6%
B05DProcesses for applying fluent materials to surfaces, in general2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
10,886,215Interconnect structure and related methods202110,580,696Interconnects formed by a metal displacement reaction202010,224,284Soluble self aligned barrier layer for interconnect structure201910,109,524Recessing of liner and conductor for via formation20189,768,058'Methods of forming air gaps in metallization layers on integrated circuit products'20179,236,299'Methods of forming a metal cap layer on copper-based conductive structures on an integrated circuit device'20169,054,052'Methods for integration of pore stuffing material'20158,932,934'Methods of self-forming barrier integration with pore stuffed ULK material'20158,580,665'MOSFET integrated circuit having doped conductive interconnects and methods for its manufacture'20137,696,093'Methods for forming copper interconnects for semiconductor devices'20107,615,491'Defectivity and process control of electroless deposition in microelectronics applications'20097,611,987'Defectivity and process control of electroless deposition in microelectronics applications'20097,611,988'Defectivity and process control of electroless deposition in microelectronics applications'20097,410,899'Defectivity and process control of electroless deposition in microelectronics applications'20087,393,781'Capping of metal interconnects in integrated circuit electronic devices'20087,332,193'Cobalt and nickel electroless plating in microelectronic devices'20087,268,074'Capping of metal interconnects in integrated circuit electronic devices'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2009Patents assigned to ENTHONE (7)· patent assignee history
2007–2020Based in Woodbridge, CT, US· patent location history
2010Patents assigned to ADVANCED MICRO DEVICES INC (1)· patent assignee history
2013–2020Patents assigned to GLOBALFOUNDRIES INC (8)· patent assignee history
2015Patents assigned to GLOBAL FOUNDRIES INC (2)· patent assignee history
2021Patents assigned to IMEC VZW (1)· patent assignee history
2021Based in Overijse, BE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALFOUNDRIES INC | 8 | 2013–2020 |
| ENTHONE | 7 | 2007–2009 |
| GLOBAL FOUNDRIES INC | 2 | 2015 |
| ADVANCED MICRO DEVICES INC | 1 | 2010 |
| IMEC VZW | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Woodbridge, CT, US | 16 | 2007–2020 |
| Overijse, BE | 1 | 2021 |