Inventor
Masataka Nanba
Inventor
Shiso-gun, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1080%
B23KSoldering or unsoldering20%
PatentTitleYear
7,804,160'Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method'20107,364,950'Semiconductor device and method of manufacturing the same'20087,230,322'Semiconductor device and method of manufacturing the same'20076,903,450'Semiconductor device and method of manufacturing the same'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2010Patents assigned to TOSHIBA KK (4)· patent assignee history
2005–2008Based in Shiso-gun, JP· patent location history
2010Based in Hyogo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 4 | 2005–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shiso-gun, JP | 3 | 2005–2008 |
| Hyogo, JP | 1 | 2010 |