Inventor
CHEE-KEY CHUNG
Inventor
TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H01LSemiconductor devices38%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H05KPrinted circuits4%
PatentTitleYear
12,205,906Electronic package and fabrication method thereof202512,176,327Method for fabricating electronic package202412,100,642Electronic package and fabrication method thereof202411,881,459Electronic package and fabrication method thereof202411,792,938Method for fabricating carrier structure202311,676,948Method for fabricating electronic package202311,482,470Electronic package and fabrication method thereof202211,410,954Electronic package, manufacturing method thereof and conductive structure202211,315,881Electronic package and manufacturing method thereof202211,289,346Method for fabricating electronic package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (10)· patent assignee history
2022–2025Based in TW· patent location history
2023Patents assigned to SILICON PREC INDUSTRIES CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO LTD | 10 | 2022–2025 |
| SILICON PREC INDUSTRIES CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 10 | 2022–2025 |