Inventor
Ian Hu
Inventor
Kaohsiung, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
11,081,420Substrate structure and semiconductor package structure202111,075,186Semiconductor package202111,024,557Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor die202110,985,085Semiconductor device package and method for manufacturing the same20214,787,508'Integrated circuit wafer container'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
1988Based in Hsin Chu, TW· patent location history
2021Patents assigned to ADVANCED SEMICONDUCTOR ENG (4)· patent assignee history
2021Based in Kaohsiung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 4 | 2021 |
| TAIWAN SEMICONDUCTOR MFG | 1 | 1988 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 4 | 2021 |
| Hsin Chu, TW | 1 | 1988 |