Inventor
SHANKAR DEVASENATHIPATHY
Inventor
US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H01LSemiconductor devices32%
H05KPrinted circuits11%
H01RElectrically-conductive connections5%
B05CApparatus for applying fluent materials to surfaces, in general3%
B05DProcesses for applying fluent materials to surfaces, in general3%
C23CCoating metallic material3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
G06FElectric digital data processing3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
12,266,589Enhanced base die heat path using through-silicon vias202512,057,369Enhanced base die heat path using through-silicon vias202411,923,268Printed heat spreader structures and methods of providing same202411,901,262Cooling solution including microchannel arrays and methods of forming the same202411,854,935Enhanced base die heat path using through-silicon vias202311,854,931STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die202311,679,407Liquid metal thermal interface material application202311,646,244Socket loading mechanism for passive or active socket and package cooling202311,581,671Integrated circuit package socket housing to enhance package cooling202311,502,008Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control202211,456,232Thermal assemblies for multi-chip packages202211,444,003Integrated heat spreader with multiple channels for multichip packages202211,398,414Sloped metal features for cooling hotspots in stacked-die packages202211,322,456Die back side structures for warpage control2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (14)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 14 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 14 | 2022–2025 |