Inventor

Ming-Chih Yew

Inventor

Hsinchu, TW

Overview

38→

Patents

1976–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 38 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%

H01LSemiconductor devices31%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%

H05KPrinted circuits6%

B60GVehicle suspension arrangements4%

F02BInternal-combustion piston engines2%

F16FSprings2%

H10DInorganic electric semiconductor devices2%

Y02TClimate change mitigation technologies related to transportation2%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%

PatentTitleYear

11,062,997Method for forming chip package structure2021 10,971,461Semiconductor device and method of manufacture2021 10,867,976Semiconductor packages having dummy connectors and methods of forming same2020 10,854,563Device, semiconductor package and method of manufacturing semiconductor package2020 10,797,005Semiconductor package and method for manufacturing the same2020 10,685,920Semiconductor device package with warpage control structure2020 10,665,559Device, semiconductor package and method of manufacturing semiconductor package2020 10,510,734Semiconductor packages having dummy connectors and methods of forming same2019 10,276,548Semiconductor packages having dummy connectors and methods of forming same2019 10,008,480Package-on-package structure with through molding via2018 9,887,144'Ring structure for chip packaging'2018 9,831,190Semiconductor device package with warpage control structure2017 9,780,076'Package-on-package structure with through molding via'2017 9,748,156'Semiconductor package assembly, semiconductor package and forming method thereof'2017 9,721,868'Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate'2017 9,653,391'Semiconductor packaging structure and manufacturing method thereof'2017 9,583,474'Package on packaging structure and methods of making same'2017 9,548,281'Electrical connection for chip scale packaging'2017 9,543,284'3D packages and methods for forming the same'2017 9,515,038'Electrical connection for chip scale packaging'2016 9,502,387'Package-on-package structure with through molding via'2016 9,502,323'Method of forming encapsulated semiconductor device package'2016 9,252,076'3D packages and methods for forming the same'2016 9,237,647'Package-on-package structure with through molding via'2016 9,087,882'Electrical connection for chip scale packaging'2015 8,946,888'Package on packaging structure and methods of making same'2015 8,941,248'Semiconductor device package and method'2015 8,901,732'Semiconductor device package and method'2014 8,847,369'Packaging structures and methods for semiconductor devices'2014 8,624,392'Electrical connection for chip scale packaging'2014 7,884,464'3D electronic packaging structure having a conductive support substrate'2011 4,781,364'Elastic beam-torsion rod connection'1988 4,568,096'Automatic vehicle level control'1986 4,540,197'Vehicle wheel suspension'1985 4,377,298'Vehicle wheel suspension'1983 4,129,817'Stepped voltage power supply with equalized discharge of battery cells'1978 3,995,605'Jet ignition engine with singly actuated dual inlet valves'1976 3,987,769'Jet ignition engine with valve-carried ignition chamber'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–1988Patents assigned to GEN MOTORS CORP (7)· patent assignee history

1976–1988Based in Rochester, MI, US· patent location history

2011–2021Based in Hsinchu, TW· patent location history

2014–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (8)· patent assignee history

2014–2017Patents assigned to LIN PO-YAO (4)· patent assignee history

2014–2017Patents assigned to YEW MING-CHIH (4)· patent assignee history

2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (22)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	22	2016–2021
TAIWAN SEMICONDUCTOR MFG	8	2014–2016
GEN MOTORS CORP	7	1976–1988
LIN PO-YAO	4	2014–2017
YEW MING-CHIHself	4	2014–2017

Locations

Location	Patents	Span
Hsinchu, TW	31	2011–2021
Rochester, MI, US	7	1976–1988