Inventor
JOACHIM MAHLER
Inventor
DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
B23KSoldering or unsoldering9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y10TTechnical subjects covered by former us classification9%
PatentTitleYear
12,033,972Chip package, method of forming a chip package and method of forming an electrical contact202411,682,644Semiconductor device with a heterogeneous solder joint and method for fabricating the same202311,296,015Die attach methods and semiconductor devices manufactured based on such methods202211,189,537Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2021Patents assigned to FUERGUT EDWARD (1)· patent assignee history
2021Patents assigned to HOSSEINI KHALIL (1)· patent assignee history
2021Patents assigned to MAHLER JOACHIM (1)· patent assignee history
2021–2024Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 4 | 2021–2024 |
| FUERGUT EDWARD | 1 | 2021 |
| HOSSEINI KHALIL | 1 | 2021 |
| MAHLER JOACHIMself | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 4 | 2021–2024 |