Inventor
Pei-Hsuan Lee
Inventor
Taipei, TW
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H10DInorganic electric semiconductor devices8%
G06TImage data processing or generation, in general6%
H01QAntennas, i.e. radio aerials6%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
A61KPreparations for medical, dental or toiletry purposes2%
C23CCoating metallic material2%
PatentTitleYear
11,121,046Wafer-level testing method and test structure thereof202111,075,439Electronic device and manufacturing method thereof202111,004,758Integrated circuit package and method202110,879,135Overlay error and process window metrology202010,813,887Acid resistant capsule shell composition202010,790,142Selective capping processes and structures formed thereby202010,770,288Selective capping processes and structures formed thereby202010,756,052Method of manufacturing integrated fan-out package202010,727,118Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device202010,510,623Overlay error and process window metrology201910,366,966Method of manufacturing integrated fan-out package20199,887,073'Physical vapor deposition system and physical vapor depositing method using the same'20189,805,951'Method of integration process for metal CMP'20179,460,939'Package-on-package structures and methods of manufacture thereof'20169,425,179'Chip packages and methods of manufacture thereof'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
2016–2021Based in Tainan, TW· patent location history
2017–2021Based in Taipei, TW· patent location history
2020Patents assigned to DAH FENG CAPSULE IND CO LTD (1)· patent assignee history
2020Based in Taichung, TW· patent location history
2020Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 14 | 2016–2021 |
| DAH FENG CAPSULE IND CO LTD | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 7 | 2017–2021 |
| Tainan, TW | 6 | 2016–2021 |
| Taichung, TW | 1 | 2020 |
| Hsinchu, TW | 1 | 2020 |