LexDanaLexDanabeta
Inventor

Dana A. Stoddard

Inventor
Boise, ID, US

Overview

3→
Patents
2003–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,951,646'Solder ball landpad design to improve laminate performance'20116,914,326'Solder ball landpad design to improve laminate performance'20056,577,004'Solder ball landpad design to improve laminate performance'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2005Patents assigned to MICRON TECHNOLOGY INC (2)· patent assignee history
2003–2011Based in Boise, ID, US· patent location history
2011Patents assigned to ROUND ROCK RES LLC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC22003–2005
ROUND ROCK RES LLC12011
Locations
LocationPatentsSpan
Boise, ID, US32003–2011