Inventor
Youko Nishiwaki
Inventor
Ibi-gun, JP
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits29%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests29%
Y10TTechnical subjects covered by former us classification29%
C23CCoating metallic material14%
PatentTitleYear
6,261,671'Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board'20016,248,428'Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001Patents assigned to IBIDEN CO LTD (2)· patent assignee history
2001Based in Ibi-gun, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBIDEN CO LTD | 2 | 2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibi-gun, JP | 2 | 2001 |