Inventor

Karl A. Littau

Inventor
Palo Alto, CA, US

Overview

77→
Patents
1994–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 77 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10NElectric solid-state devices not otherwise provided for7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
Y10TTechnical subjects covered by former us classification5%
B41JTypewriters4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
B01DSeparation4%
H01JElectric discharge tubes or discharge lamps4%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%
PatentTitleYear
10,833,263Current compliance layers and memory arrays comprising thereof202010,580,978Current compliance layers and memory arrays comprising thereof202010,364,497Vapor based site-isolated processing systems and methods201910,232,537Interdigitated finger coextrusion device201910,071,518Method for interdigitated finger coextrusion20189,819,040'Printed fuel cell with integrated gas channels'20179,589,692'Interdigitated electrode device'20179,586,181'Electrodialytic separation of CO2 gas from seawater'20179,337,030'Method to grow in-situ crystalline IGZO using co-sputtering targets'20169,150,966'Solar cell metallization using inline electroless plating'20159,004,001'Interdigitated finger coextrusion device'20158,900,435'Separating gas using ion exchange'20148,784,632'High-pressure electrodialysis device'20148,778,156'Electrodialytic separation of gas from aqueous carbonate and bicarbonate solutions'20148,535,502'System and method for recovery of CO2 by aqueous carbonate flue gas capture and high efficiency bipolar membrane electrodialysis'20138,389,165'Printed fuel cell with integrated gas channels'20138,210,661'Stacked slice printhead'20128,156,725'CO2 capture during compressed air energy storage'20128,075,789'Remote plasma cleaning source having reduced reactivity with a substrate processing chamber'20118,029,599'Separating gas using immobilized buffers'20118,023,866'Powdered toner direct marking apparatus'20117,938,892'Producing articles that include ionic liquids'20117,938,891'Using ionic liquids'20117,938,890'Separating gas using immobilized buffers'20117,901,130'Method and apparatus for calibrating a thermistor'20117,851,226'Osmotic reaction detector for monitoring biological and non-biological reactions'20107,833,808'Methods for forming multiple-layer electrode structures for silicon photovoltaic cells'20107,794,662'Osmotic reaction detector for monitoring biological and non-biological reactions'20107,763,794'Heterojunction photovoltaic cell'20107,709,385'Method for depositing tungsten-containing layers by vapor deposition techniques'20107,615,375'Osmotic reaction cell for monitoring biological and non-biological reactions'20097,574,787'Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure'20097,572,051'Method and apparatus for calibrating a thermistor'20097,553,669'Osmotic reaction detector for monitoring biological and non-biological reactions'20097,465,665'Method for depositing tungsten-containing layers by vapor deposition techniques'20087,445,315'Thin film and thick film heater and control architecture for a liquid drop ejector'20087,290,336'Method of fabricating an array of multi-electroded piezoelectric transducers for piezoelectric diaphragm structures'20077,234,214'Methods for making thick film elements'20077,220,673'Method for depositing tungsten-containing layers by vapor deposition techniques'20077,176,600'Poling system for piezoelectric diaphragm structures'20077,172,707'Sputtered spring films with low stress anisotropy'20077,118,990'Methods for making large dimension, flexible piezoelectric ceramic tapes'20067,101,795'Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer'20067,091,650'Piezoelectric ceramic thick film element, array of elements, and devices'20067,089,635'Methods to make piezoelectric ceramic thick film arrays and elements'20067,084,555'Piezoelectric diaphragm structure with outer edge electrode'20067,053,532'Radially poled piezoelectric diaphragm structures'20066,987,348'Piezoelectric transducers'20066,967,431'Piezoelectric transducers and methods of manufacture'20056,964,201'Large dimension, flexible piezoelectric ceramic tapes'20056,924,584'Piezoelectric transducers utilizing sub-diaphragms'20056,866,255'Sputtered spring films with low stress anisotropy'20056,646,235'Multi-zone resistive heater'20036,645,884'Method of forming a silicon nitride layer on a substrate'20036,500,742'Construction of a film on a semiconductor wafer'20026,461,435'Showerhead with reduced contact area'20026,444,036'Construction of a film on a semiconductor wafer'20026,423,949'Multi-zone resistive heater'20026,291,343'Plasma annealing of substrates to improve adhesion'20016,251,758'Construction of a film on a semiconductor wafer'20016,231,674'Wafer edge deposition elimination'20016,125,859'Method for improved cleaning of substrate processing systems'20006,103,014'Chemical vapor deposition chamber'20006,071,572'Forming tin thin films using remote activated specie generation'20006,033,480'Wafer edge deposition elimination'20006,024,799'Chemical vapor deposition manifold'20005,989,999'Construction of a tantalum nitride film on a semiconductor wafer'19995,935,338'Chemical vapor deposition chamber'19995,888,304'Heater with shadow ring and purge above wafer surface'19995,882,419'Chemical vapor deposition chamber'19995,858,464'Methods and apparatus for minimizing excess aluminum accumulation in CVD chambers'19995,856,240'Chemical vapor deposition of a thin film onto a substrate'19995,800,686'Chemical vapor deposition chamber with substrate edge protection'19985,766,365'Removable ring for controlling edge deposition in substrate processing apparatus'19985,695,568'Chemical vapor deposition chamber'19975,516,367'Chemical vapor deposition chamber with a purge guide'19965,326,725'Clamping ring and susceptor therefor'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2011Patents assigned to APPLIED MATERIALS INC (30)· patent assignee history
1994–2000Based in Sunnyvale, CA, US· patent location history
1998–2020Based in Palo Alto, CA, US· patent location history
2005–2019Patents assigned to PALO ALTO RES CT INC (38)· patent assignee history
2005–2011Patents assigned to XEROX CORP (5)· patent assignee history
2011–2015Patents assigned to LITTAU KARL A (8)· patent assignee history
2016–2020Patents assigned to INTERMOLECULAR INC (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PALO ALTO RES CT INC382005–2019
APPLIED MATERIALS INC301994–2011
LITTAU KARL Aself82011–2015
XEROX CORP52005–2011
INTERMOLECULAR INC42016–2020
Locations
LocationPatentsSpan
Palo Alto, California, US701998–2020
Sunnyvale, California, US71994–2000