Inventor
JIA-LIANG CHEN
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G06FElectric digital data processing8%
G11BInformation storage based on relative movement between record carrier and transducer8%
H05KPrinted circuits8%
PatentTitleYear
11,862,551Interposer and semiconductor package each having conductive terminals on redistribution layer with different pitch202411,742,295Interface of integrated circuit die and method for arranging interface thereof202311,658,091Methods of manufacturing semiconductor packaging device and heat dissipation structure202311,570,886Circuit board device202311,450,586Heat dissipation structure, semiconductor packaging device, and manufacturing method of the semiconductor packaging device202211,201,100Solid-state storage device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to GLOBAL UNICHIP CORP (6)· patent assignee history
2021–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2021–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBAL UNICHIP CORP | 6 | 2021–2024 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2021–2024 |