Inventor

YU-CHI CHANG

Inventor
TW

Overview

37→
Patents
2022–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 37 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation24%
H01LSemiconductor devices21%
H04NPictorial communication, e.g. television11%
H10DInorganic electric semiconductor devices9%
G02BOptical elements, systems or apparatus7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G06TImage data processing or generation, in general4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
H10KOrganic electric solid-state devices3%
H10BElectronic memory devices2%
PatentTitleYear
12,593,521Image sensor and method of manufacturing the same202612,543,326Deep trench capacitor and methods of forming the same202612,538,602Image sensor comprising inner grid and outer grid202612,514,007Solid-state image sensor including light-splitting structure202512,408,460Image sensor and method of forming the same202512,408,457Image sensing device with multiple optical layers formed on micro lens202512,408,459Image sensor having liquid-lens units and method for detecting images202512,372,686Meta optical device, optical system, and method for aberration correction202512,376,395Optical devices202512,366,693Image sensor202512,363,972Semiconductor structure and associated manufacturing method202512,356,745Optical device202512,331,400Surface treatment apparatus202512,256,575Image sensor202512,191,333Solid-state image sensor202512,191,374Semiconductor device with reduced flicker noise202512,176,387Trench capacitor profile to decrease substrate warpage202412,107,136Schottky diode and method of fabrication thereof202412,046,609Solid-state image sensor202412,048,172Solid-state image sensor202412,046,611Solid-state image sensor202412,033,285Object identification device and object identification method202412,027,548Image sensor202411,923,352Semiconductor device with capacitor and method for forming the same202411,901,380Solid-state image sensor202411,837,617Under-display camera system and operating method thereof202311,832,001Image processing method and image processing system202311,769,792Trench capacitor profile to decrease substrate warpage202311,710,754Solid-state image sensor including modulation layer decreasing petal flares202311,699,768Patterned electrode structure for image sensor202311,688,789Semiconductor device with reduced flicker noise202311,664,399Solid-state image sensor202311,631,709Solid-state image sensor202311,538,839Solid-state image sensor including patterned structure for decreasing petal flares202211,489,058Semiconductor structure and associated manufacturing method202211,477,364Solid-state image sensor2022D0941902Monitoring camera2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to VISERA TECHNOLOGIES CO LTD (25)· patent assignee history
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022Patents assigned to COMPAL ELECTRONICS INC (1)· patent assignee history
2022–2026Based in TW· patent location history
2025Patents assigned to CREATING NANO TECH INC (1)· patent assignee history
2025Patents assigned to TECH COMPANY LIMITED (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
VISERA TECHNOLOGIES CO LTD252022–2026
TAIWAN SEMICONDUCTOR MFG CO LTD92022–2026
COMPAL ELECTRONICS INC12022
CREATING NANO TECH INC12025
TECH COMPANY LIMITED12025
Locations
LocationPatentsSpan
TW372022–2026