Inventor
SAO-LING CHIU
Inventor
TW
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices39%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
PatentTitleYear
12,431,435Semiconductor packages and methods of forming the same202512,283,541Manufacturing method of semiconductor package202512,170,237Semiconductor structure and manufacturing method thereof202412,113,027Three-dimensional integrated circuit structures and methods of forming the same202411,967,546Giga interposer integration through Chip-On-Wafer-On-Substrate202411,916,009Semiconductor package and manufacturing method thereof202411,901,306Semiconductor structure202411,810,793Semiconductor packages and methods of forming same202311,728,278Board substrates, three-dimensional integrated circuit structures and methods of forming the same202311,728,254Giga interposer integration through chip-on-wafer-on-substrate202311,715,675Semiconductor device and manufacturing method thereof202311,715,681Fan-out package structure and method202311,552,054Package structure and method of manufacturing the same202311,545,438Semiconductor packages and methods of forming the same202311,502,043Semiconductor structure and method for fabricating semiconductor structure202211,495,472Semicondutor packages and methods of forming same202211,373,946Semiconductor package and manufacturing method thereof202211,302,600Semiconductor device and manufacturing method thereof202211,152,312Packages with interposers and methods for forming the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (19)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 19 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 19 | 2021–2025 |