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Inventor

Naoko Yamaguchi

Inventor
Yokohama, JP

Overview

23→
Patents
2002–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits14%
Y10TTechnical subjects covered by former us classification14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
G03GElectrography9%
A47JKitchen equipment4%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers4%
D04HMaking textile fabrics, e.g. from fibres or filamentary material4%
B01DSeparation3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
PatentTitleYear
10,548,427Sheet for extraction, extraction filter, and extraction bag20209,873,141Filler layer forming method20189,732,453'Nonwoven fabric sheet, and extraction filter and extraction bag using the same'20178,822,307'Semiconductor manufacturing apparatus and semiconductor manufacturing method'20148,778,778'Manufacturing method of semiconductor device, semiconductor substrate, and camera module'20148,746,131'Drip bag'20148,609,511'Semiconductor device manufacturing method, semiconductor device, and camera module'20138,309,430'Semiconductor manufacturing apparatus and semiconductor manufacturing method'20128,220,147'Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit'20127,939,171'Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit'20117,877,871'Method of manufacturing an electronic circuit formed on a substrate'20117,498,281'Nonwoven fabric and tea bag'20097,486,921'Method of producing electronic circuit, and electronic circuit substrate'20097,469,941'Method of producing a wiring board'20087,433,637'Image forming apparatus and method of manufacturing electronic circuit using the same'20087,414,417'Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts'20087,370,412'Method for connecting electronic device'20087,350,297'Method of manufacturing a wiring substrate'20087,312,621'Semiconductor test unit having low contact resistance with examined electronic products, semiconductor contact board, method for testing semiconductor device, semiconductor device, and method for manufacturing thereof'20077,259,046'Semiconductor device and manufacturing method thereof'20077,067,398'Method of producing electronic circuit and electronic circuit'20066,977,130'Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit'20056,486,001'Fabricating method of semiconductor device'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2014Patents assigned to TOSHIBA KK (16)· patent assignee history
2002–2012Based in Yokohama, JP· patent location history
2008–2014Based in Kanagawa, JP· patent location history
2008Based in Yokokohama, JP· patent location history
2009–2020Patents assigned to OHKI CO LTD (4)· patent assignee history
2009–2020Based in Osaka, JP· patent location history
2012–2014Patents assigned to YAMAGUCHI NAOKO (6)· patent assignee history
2012–2014Patents assigned to HONGO SATOSHI (4)· patent assignee history
2012–2014Patents assigned to TANIDA KAZUMASA (4)· patent assignee history
2018Based in Kyoto, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK162002–2014
YAMAGUCHI NAOKOself62012–2014
HONGO SATOSHI42012–2014
OHKI CO LTD42009–2020
TANIDA KAZUMASA42012–2014
Locations
LocationPatentsSpan
Yokohama, JP122002–2012
Kanagawa, JP52008–2014
Osaka, JP42009–2020
Kyoto, JP12018
Yokokohama, JP12008