Inventor

Chun-Hao Chou

Inventor

Tainan, TW

Overview

2015–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 66 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices40%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation39%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

H10DInorganic electric semiconductor devices4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light1%

G02BOptical elements, systems or apparatus1%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution1%

Y02PClimate change mitigation technologies in the production or processing of goods1%

H04NPictorial communication, e.g. television1%

PatentTitleYear

10,879,290Protection ring for image sensors2020 10,879,305Image sensor2020 10,872,921Image sensor and method for fabricating the image sensor2020 10,854,530Heat dissipation structures2020 10,818,719Semiconductor device with a radiation sensing region and method for forming the same2020 10,804,307Increased optical path for long wavelength light by grating structure2020 10,777,592Image sensor and method for manufacturing thereof2020 10,770,502Semiconductor image sensor device having back side illuminated image sensors with embedded color filters2020 10,763,289Light blocking layer for image sensor device2020 10,720,460High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof2020 10,714,523Isolation structure and image sensor2020 10,692,911Polarizers for image sensor devices2020 10,651,217Structure and formation method of light sensing device2020 10,644,060Image sensor with high quantum efficiency surface structure2020 10,636,824High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof2020 10,553,631Color filter uniformity for image sensor devices2020 10,546,890Protection ring for image sensors2020 10,535,698Image sensor with pad structure2020 10,522,579Light blocking layer for image sensor device2019 10,522,580Structure and formation method of light-sensing device2019 10,504,952Increased optical path for long wavelength light by grating structure2019 10,498,947Image sensor including light shielding layer and patterned dielectric layer2019 10,490,587CIS structure with complementary metal grid and deep trench isolation and method for manufacturing the same2019 10,490,590Semiconductor image sensor device having back side illuminated image sensors with embedded color filters2019 10,483,310Isolation structure for reducing crosstalk between pixels and fabrication method thereof2019 10,475,839Semiconductor device with a radiation sensing region and method for forming the same2019 10,468,444Image sensor device and method for forming the same2019 10,367,020Polarizers for image sensor devices2019 10,304,885Color filter uniformity for image sensor devices2019 10,276,616Image sensor device2019 10,276,617Protection ring for image sensors2019 10,269,844Structure and formation method of light sensing device2019 10,204,960Method of forming polysilicon gate structure in image sensor device2019 10,181,491Semiconductor image sensor device having back side illuminated image sensors with embedded color filters2019 10,177,185High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof2019 10,177,191Image sensor device and method for forming the same2019 10,163,966Image sensing device and manufacturing method thereof2018 10,157,949Isolation structure for reducing crosstalk between pixels and fabrication method thereof2018 9,991,307Stacked grid design for improved optical performance and isolation2018 9,978,790Image sensor and method for manufacturing thereof2018 9,917,132'CMOS image sensor structure with IR/NIR integration'2018 9,905,601'Protection ring for image sensors'2018 9,853,076Stacked grid for more uniform optical input2017 9,847,363Semiconductor device with a radiation sensing region and method for forming the same2017 9,812,488'Backside illuminated image sensor and method of manufacturing the same'2017 9,806,116'Complementary metal grid and deep trench isolation in CIS application'2017 9,786,704'CMOS image sensor structure with crosstalk improvement'2017 9,786,716'Method of fabricating semiconductor image sensor device having back side illuminated image sensors with embedded color filters'2017 9,768,214'Structure of dielectric grid for a semiconductor device'2017 9,761,622'CMOS image sensor structure with crosstalk improvement'2017 9,728,573'Backside illuminated image sensor and method of manufacturing the same'2017 9,711,560'CMOS image sensor structure with IR/NIR integration'2017 9,679,939'Backside illuminated image sensor device'2017 9,659,985'Integrated circuit and image sensing device having metal shielding layer and related fabricating method'2017 9,613,916'Protection ring for image sensors'2017 9,608,021'Image sensor and method for manufacturing thereof'2017 9,570,493'Dielectric grid bottom profile for light focusing'2017 9,559,135'Conduction layer for stacked CIS charging prevention'2017 9,525,001'Semiconductor device and manufacturing method thereof'2016 9,478,578'Stress release layout and associated methods and devices'2016 9,461,089'Method of fabricating semiconductor image sensor device having back side illuminated image sensors with embedded color filters'2016 9,419,048'Method of manufracturing structure of dielectric grid for a semiconductor device'2016 9,385,156'Method of manufacturing a back side illuminated (BSI) image sensor'2016 9,281,338'Semiconductor image sensor device having back side illuminated image sensors with embedded color filters'2016 9,224,781'Structure of dielectric grid for a semiconductor device'2015 9,196,642'Stress release layout and associated methods and devices'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (4)· patent assignee history

2015–2020Based in Tainan, TW· patent location history

2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (62)· patent assignee history

2020Patents assigned to TAIWAN SEMICONDUCTOR MANURACTURING CO LTD (1)· patent assignee history

2020Patents assigned to TAIWAN SEMICONDUTOR MFG CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	62	2016–2020
TAIWAN SEMICONDUCTOR MFG	4	2015–2016
TAIWAN SEMICONDUCTOR MANURACTURING CO LTD	1	2020
TAIWAN SEMICONDUTOR MFG CO LTD	1	2020

Locations

Location	Patents	Span
Tainan, TW	66	2015–2020